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Bjorn Vandecasteele
Bjorn Vandecasteele
CMST - imec
Verified email at elis.ugent.be
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Cited by
Year
ENOBIO dry electrophysiology electrode; first human trial plus wireless electrode system
G Ruffini, S Dunne, E Farrés, Í Cester, PCP Watts, S Ravi, P Silva, C Grau, ...
2007 29th Annual International Conference of the IEEE Engineering in …, 2007
922007
Arbitrarily shaped 2.5 D circuits using stretchable interconnects embedded in thermoplastic polymers
B Plovie, Y Yang, J Guillaume, S Dunphy, K Dhaenens, S Van Put, ...
Advanced Engineering Materials 19 (8), 1700032, 2017
522017
Enobio-first tests of a dry electrophysiology electrode using carbon nanotubes
G Ruffini, S Dunne, E Farrés, PCP Watts, E Mendoza, SRP Silva, C Grau, ...
2006 International Conference of the IEEE Engineering in Medicine and …, 2006
502006
Flip-chip assembly of semiconductor devices using adhesives
J Vanfleteren, S Stoukach, B Vandecasteele
US Patent 6,555,414, 2003
422003
Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects
G Vakanas, O Minho, B Dimcic, K Vanstreels, B Vandecasteele, ...
Microelectronic Engineering 140, 72-80, 2015
412015
3D Multifunctional Composites Based on Large‐Area Stretchable Circuit with Thermoforming Technology
Y Yang, T Vervust, S Dunphy, S Van Put, B Vandecasteele, K Dhaenens, ...
Advanced Electronic Materials 4 (8), 1800071, 2018
362018
Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils
M Cauwe, B Vandecasteele, A Gielen, J De Baets, J van den Brand, ...
18th European Microelectronics & Packaging Conference, 1-6, 2011
262011
Comparison of different flex materials in high density flip chip on flex applications
P Palm, J Määttänen, Y De Maquillé, A Picault, J Vanfleteren, ...
Microelectronics Reliability 43 (3), 445-451, 2003
232003
Arbitrarily shaped 2.5 D circuits using stretchable interconnections and embedding in thermoplastic polymers
J Vanfleteren, I Chtioui, B Plovie, Y Yang, F Bossuyt, T Vervust, S Dunphy, ...
Procedia Technology 15, 208-215, 2014
222014
Development of an active high-density transverse intrafascicular micro-electrode probe
R Verplancke, M Cauwe, D Schaubroeck, D Cuypers, B Vandecasteele, ...
Journal of Micromechanics and Microengineering 30 (1), 015010, 2019
202019
Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves
MO de Beeck, R Verplancke, D Schaubroeck, D Cuypers, M Cauwe, ...
2017 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2017
192017
Adhesive bonding by SU-8 transfer for assembling microfluidic devices
P Salvo, R Verplancke, F Bossuyt, D Latta, B Vandecasteele, C Liu, ...
Microfluidics and nanofluidics 13, 987-991, 2012
192012
A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
M Cauwe, B Vandecasteele, J De Baets, J van den Brand, R Kusters, ...
2012 4th Electronic System-Integration Technology Conference, 1-6, 2012
92012
2.5 D smart objects using thermoplastic stretchable interconnects
B Plovie, S Dunphy, K Dhaenens, S Van Put, B Vandecasteele, F Bossuyt, ...
International Symposium on Microelectronics 2015 (1), 000868-000873, 2015
82015
Low temperature flip-chip process using ICA and NCA (isotropically and non-conductive adhesive) for flexible displays application
J Vanfleteren, B Vandecasteele, T Podprocky
4th Electronics Packaging Technology Conference, 2002., 139-143, 2002
82002
Reliability of different flex materials in high density flip chip on flex applications
P Palm, J Maattanen, Y De Maquillé, A Picault, J Vanfleteren, ...
First International IEEE Conference on Polymers and Adhesives in …, 2001
82001
Sn whisker evaluations in 3D microbumped structures
GP Vakanas, B Vandecasteele, D Schaubroek, J De Messemaeker, ...
Microelectronics Reliability 54 (9-10), 1982-1987, 2014
62014
Co-Sn intermetallic compoundsfor potential integration in 3D interconnects
G Vakanas, B Dimcic, B Vandecasteele, K Vanstreels, J De Messemaeker, ...
62014
An approach to produce a stack of photo definable polyimide based flat UTCPs
S Priyabadini, T Sterken, L Wang, K Dhaenens, B Vandecasteele, ...
2012 4th Electronic System-Integration Technology Conference, 1-4, 2012
62012
FITEP: a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers
M Op de Beeck, R Verplancke, D Schaubroeck, C Li, D Cuypers, ...
2019 Advanced Technology Workshop on Advanced Packaging for Medical …, 2019
42019
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