ENOBIO dry electrophysiology electrode; first human trial plus wireless electrode system G Ruffini, S Dunne, E Farrés, Í Cester, PCP Watts, S Ravi, P Silva, C Grau, ... 2007 29th Annual International Conference of the IEEE Engineering in …, 2007 | 92 | 2007 |
Arbitrarily shaped 2.5 D circuits using stretchable interconnects embedded in thermoplastic polymers B Plovie, Y Yang, J Guillaume, S Dunphy, K Dhaenens, S Van Put, ... Advanced Engineering Materials 19 (8), 1700032, 2017 | 53 | 2017 |
Enobio-first tests of a dry electrophysiology electrode using carbon nanotubes G Ruffini, S Dunne, E Farrés, PCP Watts, E Mendoza, SRP Silva, C Grau, ... 2006 International Conference of the IEEE Engineering in Medicine and …, 2006 | 50 | 2006 |
Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects G Vakanas, O Minho, B Dimcic, K Vanstreels, B Vandecasteele, ... Microelectronic Engineering 140, 72-80, 2015 | 43 | 2015 |
Flip-chip assembly of semiconductor devices using adhesives J Vanfleteren, S Stoukach, B Vandecasteele US Patent 6,555,414, 2003 | 42 | 2003 |
3D Multifunctional Composites Based on Large‐Area Stretchable Circuit with Thermoforming Technology Y Yang, T Vervust, S Dunphy, S Van Put, B Vandecasteele, K Dhaenens, ... Advanced Electronic Materials 4 (8), 1800071, 2018 | 37 | 2018 |
Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils M Cauwe, B Vandecasteele, A Gielen, J De Baets, J van den Brand, ... 18th European Microelectronics & Packaging Conference, 1-6, 2011 | 24 | 2011 |
Arbitrarily shaped 2.5 D circuits using stretchable interconnections and embedding in thermoplastic polymers J Vanfleteren, I Chtioui, B Plovie, Y Yang, F Bossuyt, T Vervust, S Dunphy, ... Procedia Technology 15, 208-215, 2014 | 23 | 2014 |
Comparison of different flex materials in high density flip chip on flex applications P Palm, J Määttänen, Y De Maquillé, A Picault, J Vanfleteren, ... Microelectronics Reliability 43 (3), 445-451, 2003 | 23 | 2003 |
Development of an active high-density transverse intrafascicular micro-electrode probe R Verplancke, M Cauwe, D Schaubroeck, D Cuypers, B Vandecasteele, ... Journal of Micromechanics and Microengineering 30 (1), 015010, 2019 | 20 | 2019 |
Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves MO de Beeck, R Verplancke, D Schaubroeck, D Cuypers, M Cauwe, ... 2017 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2017 | 19 | 2017 |
Adhesive bonding by SU-8 transfer for assembling microfluidic devices P Salvo, R Verplancke, F Bossuyt, D Latta, B Vandecasteele, C Liu, ... Microfluidics and nanofluidics 13, 987-991, 2012 | 19 | 2012 |
A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels M Cauwe, B Vandecasteele, J De Baets, J van den Brand, R Kusters, ... 2012 4th Electronic System-Integration Technology Conference, 1-6, 2012 | 9 | 2012 |
2.5 D smart objects using thermoplastic stretchable interconnects B Plovie, S Dunphy, K Dhaenens, S Van Put, B Vandecasteele, F Bossuyt, ... International Symposium on Microelectronics 2015 (1), 000868-000873, 2015 | 8 | 2015 |
Low temperature flip-chip process using ICA and NCA (isotropically and non-conductive adhesive) for flexible displays application J Vanfleteren, B Vandecasteele, T Podprocky 4th Electronics Packaging Technology Conference, 2002., 139-143, 2002 | 8 | 2002 |
Reliability of different flex materials in high density flip chip on flex applications P Palm, J Maattanen, Y De Maquillé, A Picault, J Vanfleteren, ... First International IEEE Conference on Polymers and Adhesives in …, 2001 | 8 | 2001 |
Sn whisker evaluations in 3D microbumped structures GP Vakanas, B Vandecasteele, D Schaubroek, J De Messemaeker, ... Microelectronics Reliability 54 (9-10), 1982-1987, 2014 | 6 | 2014 |
Co-Sn intermetallic compoundsfor potential integration in 3D interconnects G Vakanas, B Dimcic, B Vandecasteele, K Vanstreels, J De Messemaeker, ... | 6 | 2014 |
An approach to produce a stack of photo definable polyimide based flat UTCPs S Priyabadini, T Sterken, L Wang, K Dhaenens, B Vandecasteele, ... 2012 4th Electronic System-Integration Technology Conference, 1-4, 2012 | 6 | 2012 |
FITEP: a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers M Op de Beeck, R Verplancke, D Schaubroeck, C Li, D Cuypers, ... 2019 Advanced Technology Workshop on Advanced Packaging for Medical …, 2019 | 4 | 2019 |