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Co-authors
- Yuhao ZhangUniversity of Hong KongVerified email at hku.hk
- Han WangUniversity of Hong KongVerified email at hku.hk
- Lili YuMeta AIVerified email at mit.edu
- J. W. ChungSamsung ElectronicsVerified email at samsung.com
- Ki Kang KimDepartment of Energy Science, Sungkyunkwan UniversityVerified email at skku.edu
- Bin LuEECS, Massachusetts Institute of TechnologyVerified email at mit.edu
- Steven DenBaarsProfessor of Materials, University of California Santa BarbaraVerified email at engineering.ucsb.edu
- Siddharth RajanElectrical and Computer Engineering, Ohio State UniversityVerified email at ece.osu.edu
- Eva MonroyCEA, IRIG, PHELIQS-NPSC, Grenoble, FranceVerified email at cea.fr
- Hyung-Seok LeeMassachusetts Institute of TechnologyVerified email at etri.re.kr
- Elison MatioliEcole Polytechnique Fédérale de Lausanne (EPFL)Verified email at epfl.ch
- Alessandro ChiniProfessor of Electronics, University of Modena and Reggio Emilia, ItalyVerified email at unimore.it
- Stephen W. KaunApeel SciencesVerified email at apeelsciences.com
- Fernando B. NaranjoAssociate Professor at University of AlcaláVerified email at depeca.uah.es
- Madhusudan SinghAssociate Professor at Indian Institute of Technology, DelhiVerified email at umich.edu