Thomas M. Moore
Cited by
Cited by
Method for sample separation and lift-out with one cut
TM Moore, RD Kruger, C Hartfield
US Patent 6,420,722, 2002
Total release method for sample extraction from a charged-particle instrument
TM Moore
US Patent 6,570,170, 2003
Autonomous mobile goods transfer
JA Healey, OUF Choque
US Patent 10,252,659, 2019
The impact of delamination on stress-induced and contamination-related failure in surface mount ICs
TM Moore, SJ Kelsall
Proceedings of the International Reliability Physics Symposium, 169-176, 1992
Characterization of integrated circuit packaging materials
T Moore
Elsevier, 2013
Continuous wave resonant photon stimulated electron energy-gain and electron energy-loss spectroscopy of individual plasmonic nanoparticles
C Liu, Y Wu, Z Hu, JA Busche, EK Beutler, NP Montoni, TM Moore, ...
ACS Photonics 6 (10), 2499-2508, 2019
Method for STEM sample inspection in a charged particle beam instrument
L Zaykova-Feldman, TM Moore, G Amador, M Hammer
US Patent 7,834,315, 2010
C-mode acoustic microscopy applied to integrated circuit package inspection
TM Moore
Solid-state electronics 35 (3), 411-421, 1992
Laser-Assisted Focused He+ Ion Beam Induced Etching with and without XeF2 Gas Assist
MG Stanford, K Mahady, BB Lewis, JD Fowlkes, S Tan, R Livengood, ...
ACS applied materials & interfaces 8 (42), 29155-29162, 2016
Exploring photothermal pathways via in situ laser heating in the transmission electron microscope: recrystallization, grain growth, phase separation, and dewetting in Ag0. 5Ni0 …
Y Wu, C Liu, TM Moore, GA Magel, DA Garfinkel, JP Camden, ...
Microscopy and microanalysis 24 (6), 647-656, 2018
Method and apparatus for in-situ probe tip replacement inside a charged particle beam microscope
TM Moore, L Zaykova-Feldman
US Patent 7,381,971, 2008
Correlation of surface mount plastic package reliability testing to nondestructive inspection by scanning acoustic microscopy
TM Moore, R McKenna, SJ Kelsall
Proc. Int. Reliability Physics Symposium, 160-166, 1991
Method and apparatus for the automated process of in-situ lift-out
TM Moore, L Zaykova-Feldman
US Patent 7,414,252, 2008
FIB lift-out for defect analysis
LA Giannuzzi, BW Kempshall, SD Anderson, BI Prenitzer, TM Moore
Microelectronic Failure Analysis: Desk Reference, 29-35, 2002
Method and apparatus for acquiring simultaneous and overlapping optical and charged particle beam images
TM Moore, C Hartfield, GA Magel
US Patent 8,440,969, 2013
In situ laser processing in a scanning electron microscope
NA Roberts, GA Magel, CD Hartfield, TM Moore, JD Fowlkes, PD Rack
Journal of Vacuum Science & Technology A 30 (4), 2012
EBIC characterization of electrically active defects in (Hg, Cd) Te
TM Moore, HF Schaake
Journal of Vacuum Science Technology A: Vacuum Surfaces and Films 1 (3 …, 1983
Identification of package defects in plastic-packaged surface-mount ICs by scanning acoustic microscopy
TM Moore
ISTFA 89, 61-67, 1989
TEM sample holder
TM Moore
US Patent 7,115,882, 2006
Mechanical characterization of low-K dielectric materials
TM Moore, CD Hartfield, JM Anthony, BT Ahlburn, PS Ho, MR Miller
AIP conference proceedings 550 (1), 431-439, 2001
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