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Dr. Sebastian Brand
Dr. Sebastian Brand
Fraunhofer IMWS
Verified email at imws.fraunhofer.de
Title
Cited by
Cited by
Year
Quantitative ultrasound characterization of responses to radiotherapy in cancer mouse models
RM Vlad, S Brand, A Giles, MC Kolios, GJ Czarnota
Clinical cancer research 15 (6), 2067-2075, 2009
1252009
Non-destructive estimation of the intramuscular fat content of the longissimus muscle of pigs by means of spectral analysis of ultrasound echo signals
D Mörlein, F Rosner, S Brand, KV Jenderka, M Wicke
Meat Science 69 (2), 187-199, 2005
832005
High frequency ultrasound tissue characterization and acoustic microscopy of intracellular changes
S Brand, EC Weiss, RM Lemor, MC Kolios
Ultrasound in medicine & biology 34 (9), 1396-1407, 2008
812008
Scientific papers
A Yori, M Möser, A Habib, A Shelke, M Vogel, S Brand, X Jiang, U Pietsch, ...
791900
Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy
S Brand, P Czurratis, P Hoffrogge, M Petzold
Microelectronics Reliability 50 (9-11), 1469-1473, 2010
532010
3D sensor application with open through silicon via technology
J Kraft, F Schrank, J Teva, J Siegert, G Koppitsch, C Cassidy, ...
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 560-566, 2011
502011
Extending acoustic microscopy for comprehensive failure analysis applications
S Brand, P Czurratis, P Hoffrogge, D Temple, D Malta, J Reed, M Petzold
Journal of Materials Science: Materials in Electronics 22, 1580-1593, 2011
452011
Ultrasound velocity and attenuation of porcine soft tissues with respect to structure and composition: I. Muscle
T Koch, S Lakshmanan, S Brand, M Wicke, K Raum, D Mörlein
Meat Science 88 (1), 51-58, 2011
452011
Ultrasound velocity and attenuation of porcine soft tissues with respect to structure and composition: II. Skin and backfat
T Koch, S Lakshmanan, S Brand, M Wicke, K Raum, D Mörlein
Meat science 88 (1), 67-74, 2011
402011
Quantitative Ultrasonic Characterization of c-axis oriented polycrystalline AlN thin film for smart device application
A Habib, A Shelke, M Vogel, S Brand, X Jiang, U Pietsch, S Banerjee, ...
Acta Acustica united with Acustica 101 (4), 675-683, 2015
382015
Scanning acoustic gigahertz microscopy for metrology applications in three-dimensional integration technologies
S Brand, A Lapadatu, T Djuric, P Czurratis, J Schischka, M Petzold
Journal of Micro/Nanolithography, MEMS, and MOEMS 13 (1), 011207-011207, 2014
312014
High frequency scanning acoustic microscopy applied to 3D integrated process: void detection in through silicon vias
A Phommahaxay, I De Wolf, P Hoffrogge, S Brand, P Czurratis, ...
2013 IEEE 63rd Electronic Components and Technology Conference, 227-231, 2013
292013
Prediction of the intramuscular fat content in loin muscle of pig carcasses by quantitative time-resolved ultrasound
S Lakshmanan, T Koch, S Brand, N Männicke, M Wicke, D Mörlein, ...
Meat science 90 (1), 216-225, 2012
282012
Monitoring of cell death in epithelial cells using high frequency ultrasound spectroscopy
S Brand, B Solanki, DB Foster, GJ Czarnota, MC Kolios
Ultrasound in medicine & biology 35 (3), 482-493, 2009
282009
Scanning acoustic GHz-microscopy versus conventional SAM for advanced assessment of ball bond and metal interfaces in microelectronic devices
G Vogg, T Heidmann, S Brand
Microelectronics Reliability 55 (9-10), 1554-1558, 2015
222015
Defect analysis using scanning acoustic microscopy for bonded microelectronic components with extended resolution and defect sensitivity
S Brand, G Vogg, M Petzold
Microsystem Technologies 24, 779-792, 2018
212018
Advanced 3D failure characterization in multi-layered PCBs
E Grünwald, R Hammer, J Rosc, GA Maier, M Bärnthaler, MJ Cordill, ...
NDT & e International 84, 99-107, 2016
202016
Ultrasonic radio-frequency spectrum analysis of normal brain tissue
M Strowitzki, S Brand, KV Jenderka
Ultrasound in medicine & biology 33 (4), 522-529, 2007
182007
Acoustic microscopy of semiconductor packages
CD Hartfield, TM Moore, S Brand
Microelectronics failure analysis desk reference, 67, 2019
172019
Non-destructive wafer-level bond defect identification by scanning acoustic microscopy
S Brand, S Tismer, ST Moe, K Schjølberg-Henriksen
Microsystem Technologies 21, 1385-1394, 2015
162015
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