| Method for sample separation and lift-out with one cut TM Moore, RD Kruger, C Hartfield US Patent 6,420,722, 2002 | 148 | 2002 |
| Hardware and techniques for cross-correlative TEM and atom probe analysis BP Gorman, D Diercks, N Salmon, E Stach, G Amador, C Hartfield Microscopy Today 16 (4), 42-47, 2008 | 94 | 2008 |
| Interface Reliability Assessments for Copper/Low-k Products CD Hartfield, ET Ogawa, YJ Park, TC Chiu, H Guo, GB Alers, K Jow, ... Transactions on Device and Materials Reliability, 2005 | 68 | 2005 |
| Adhesion strength measurement of polymer dielectric interfaces using laser spallation technique SSV Kandula, CD Hartfield, PH Geubelle, NR Sottos Thin Solid Films 516 (21), 7627-7635, 2008 | 59 | 2008 |
| Making the practically impossible “Merely difficult”—Cryogenic FIB lift‐out for “Damage free” soft matter imaging CDJ Parmenter, MW Fay, C Hartfield, HM Eltaher Microscopy research and technique 79 (4), 298-303, 2016 | 43 | 2016 |
| The LaserFIB: new application opportunities combining a high-performance FIB-SEM with femtosecond laser processing in an integrated second chamber B Tordoff, C Hartfield, AJ Holwell, S Hiller, M Kaestner, S Kelly, J Lee, ... Applied Microscopy 50 (1), 24, 2020 | 33 | 2020 |
| From PCB to BEOL: 3D X-ray microscopy for advanced semiconductor packaging C Hartfield, C Schmidt, A Gu, ST Kelly 2018 IEEE International Symposium on the Physical and Failure Analysis of …, 2018 | 24 | 2018 |
| In situ laser processing in a scanning electron microscope NA Roberts, GA Magel, CD Hartfield, TM Moore, JD Fowlkes, PD Rack Journal of Vacuum Science & Technology A 30 (4), 2012 | 23 | 2012 |
| Method and apparatus for acquiring simultaneous and overlapping optical and charged particle beam images TM Moore, C Hartfield, GA Magel US Patent 8,440,969, 2013 | 22 | 2013 |
| Acoustic microscopy of semiconductor packages CD Hartfield, TM Moore, S Brand Microelectronics Fialure Analysis Desk Reference 67, 2019 | 20 | 2019 |
| Method of improving contact resistance J Broz, C Hartfield, E Kramer, R Pak, H Rampersad, P Coffman, S Lee US Patent App. 10/319,213, 2004 | 19 | 2004 |
| Method for chemically reworking metal layers on integrated circuit bond pads C Hartfield, TM Moore US Patent 6,435,398, 2002 | 18 | 2002 |
| Mechanical characterization of low-K dielectric materials TM Moore, CD Hartfield, JM Anthony, BT Ahlburn, PS Ho, MR Miller AIP conference proceedings 550 (1), 431-439, 2001 | 18 | 2001 |
| Probing and wire bonding of aluminum capped copper pads G Hotchkiss, J Aronoff, J Broz, C Hartfield, R James, L Stark, W Subido, ... 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th …, 2002 | 17 | 2002 |
| Local thickness and composition analysis of TEM lamellae in the FIB C Lang, M Hiscock, M Dawson, C Hartfield Microelectronics Reliability 54 (9-10), 1790-1793, 2014 | 13 | 2014 |
| Failure analysis of electronic material using cryogenic FIB-SEM N Antoniou EDFA Technical Articles 15 (3), 12-19, 2013 | 12 | 2013 |
| Dielectric integrity test for flip-chip devices with Cu/low-k interconnects C Odegard, TC Chiu, C Hartfield, V Sundararaman Proceedings: Electrical Electronics Insulation Conference and Electrical …, 2005 | 11* | 2005 |
| Combined electrical test and mechanical test system for thin film characterization JJ Broz, CD Hartfield, RM Rincon US Patent 6,752,012, 2004 | 11 | 2004 |
| Assembly analytical forum analytical tool roadmap white paper R Dias, R Goruganthu, D Goyal, C Hartfield, D Hunt, D McClelland, ... International SEMATECH, 2005 | 10 | 2005 |
| Through-Transmission Acoustic Inspection of Ball Grid Array (BGA) Packages TM Moore, CD Hartfield International Symposium for Testing and Failure Analysis 30828, 197-204, 1997 | 9 | 1997 |
Thomas M. MooreWaviks, Inc.Verified email at waviks.com
