Cheryl D. Hartfield
Cited by
Cited by
Method for sample separation and lift-out with one cut
TM Moore, RD Kruger, C Hartfield
US Patent 6,420,722, 2002
Hardware and techniques for cross-correlative TEM and atom probe analysis
BP Gorman, D Diercks, N Salmon, E Stach, G Amador, C Hartfield
Microscopy Today 16 (4), 42-47, 2008
Interface Reliability Assessments for Copper/Low-k Products
CD Hartfield, ET Ogawa, YJ Park, TC Chiu, H Guo, GB Alers, K Jow, ...
Transactions on Device and Materials Reliability, 2005
Adhesion strength measurement of polymer dielectric interfaces using laser spallation technique
SSV Kandula, CD Hartfield, PH Geubelle, NR Sottos
Thin Solid Films 516 (21), 7627-7635, 2008
Making the practically impossible “Merely difficult”—Cryogenic FIB lift‐out for “Damage free” soft matter imaging
CDJ Parmenter, MW Fay, C Hartfield, HM Eltaher
Microscopy research and technique 79 (4), 298-303, 2016
The LaserFIB: new application opportunities combining a high-performance FIB-SEM with femtosecond laser processing in an integrated second chamber
B Tordoff, C Hartfield, AJ Holwell, S Hiller, M Kaestner, S Kelly, J Lee, ...
Applied Microscopy 50 (1), 24, 2020
In situ laser processing in a scanning electron microscope
NA Roberts, GA Magel, CD Hartfield, TM Moore, JD Fowlkes, PD Rack
Journal of Vacuum Science & Technology A 30 (4), 2012
From PCB to BEOL: 3D X-ray microscopy for advanced semiconductor packaging
C Hartfield, C Schmidt, A Gu, ST Kelly
2018 IEEE International Symposium on the Physical and Failure Analysis of†…, 2018
Method and apparatus for acquiring simultaneous and overlapping optical and charged particle beam images
TM Moore, C Hartfield, GA Magel
US Patent 8,440,969, 2013
Method of improving contact resistance
J Broz, C Hartfield, E Kramer, R Pak, H Rampersad, P Coffman, S Lee
US Patent App. 10/319,213, 2004
Mechanical characterization of low-K dielectric materials
TM Moore, CD Hartfield, JM Anthony, BT Ahlburn, PS Ho, MR Miller
AIP conference proceedings 550 (1), 431-439, 2001
Method for chemically reworking metal layers on integrated circuit bond pads
C Hartfield, TM Moore
US Patent 6,435,398, 2002
Probing and wire bonding of aluminum capped copper pads
G Hotchkiss, J Aronoff, J Broz, C Hartfield, R James, L Stark, W Subido, ...
2002 IEEE International Reliability Physics Symposium. Proceedings. 40th†…, 2002
Acoustic microscopy of semiconductor packages
CD Hartfield, TM Moore, S Brand
Microelectronics Fialure Analysis Desk Reference, 67, 2019
Local thickness and composition analysis of TEM lamellae in the FIB
C Lang, M Hiscock, M Dawson, C Hartfield
Microelectronics Reliability 54 (9-10), 1790-1793, 2014
Failure analysis of electronic material using cryogenic FIB-SEM
N Antoniou, A Graham, C Hartfield, G Amador
Conference Proceedings from the 38th International Symposium for Testing and†…, 2012
Dielectric integrity test for flip-chip devices with Cu/low-k interconnects
C Odegard, TC Chiu, C Hartfield, V Sundararaman
Proceedings: Electrical Electronics Insulation Conference and Electrical†…, 2005
Combined electrical test and mechanical test system for thin film characterization
JJ Broz, CD Hartfield, RM Rincon
US Patent 6,752,012, 2004
Assembly analytical forum analytical tool roadmap white paper
R Dias, R Goruganthu, D Goyal, C Hartfield, D Hunt, D McClelland, ...
International SEMATECH, 2005
In-situ quantification of TEM lamella thickness and Ga implantation in the FIB
M Hiscock, M Dawson, C Lang, C Hartfield, P Statham
Microscopy and Microanalysis 20 (S3), 342-343, 2014
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