Mukul Kumar
Cited by
Cited by
Electron backscatter diffraction in materials science
AJ Schwartz, M Kumar, BL Adams, DP Field
Springer 2, 35-52, 2009
An experimental investigation into additive manufacturing-induced residual stresses in 316L stainless steel
AS Wu, DW Brown, M Kumar, GF Gallegos, WE King
Metallurgical and Materials Transactions A 45 (13), 6260-6270, 2014
Probing the active surface sites for CO reduction on oxide-derived copper electrocatalysts
A Verdaguer-Casadevall, CW Li, TP Johansson, SB Scott, JT McKeown, ...
Journal of the American Chemical Society 137 (31), 9808-9811, 2015
Grain-boundary engineering markedly reduces susceptibility to intergranular hydrogen embrittlement in metallic materials
S Bechtle, M Kumar, BP Somerday, ME Launey, RO Ritchie
Acta materialia 57 (14), 4148-4157, 2009
Analysis of grain boundary networks and their evolution during grain boundary engineering
CA Schuh, M Kumar, WE King
Acta Materialia 51 (3), 687-700, 2003
Modifications to the microstructural topology in fcc materials through thermomechanical processing
M Kumar, WE King, AJ Schwartz
Acta Materialia 48 (9), 2081-2091, 2000
Microstructural evolution during grain boundary engineering of low to medium stacking fault energy fcc materials
M Kumar, AJ Schwartz, WE King
Acta materialia 50 (10), 2599-2612, 2002
Grain boundary energy function for fcc metals
VV Bulatov, BW Reed, M Kumar
Acta Materialia 65, 161-175, 2014
Analysis of local orientation gradients in deformed single crystals
DP Field, PB Trivedi, SI Wright, M Kumar
Ultramicroscopy 103 (1), 33-39, 2005
Effect of microstructural length scales on spall behavior of copper
RW Minich, JU Cazamias, M Kumar, AJ Schwartz
Metallurgical and Materials Transactions A 35, 2663-2673, 2004
High-cycle fatigue of nickel-based superalloy ME3 at ambient and elevated temperatures: Role of grain-boundary engineering
Y Gao, M Kumar, RK Nalla, RO Ritchie
Metallurgical and Materials Transactions A 36 (12), 3325-3333, 2005
Present state of electron backscatter diffraction and prospective developments
RA Schwarzer, DP Field, BL Adams, M Kumar, AJ Schwartz
Electron backscatter diffraction in materials science, 1-20, 2009
Atomistic modeling of shock-induced void collapse in copper
LP Davila, P Erhart, EM Bringa, MA Meyers, VA Lubarda, MS Schneider, ...
Applied Physics Letters 86 (16), 161902, 2005
High-cycle fatigue of nickel-base superalloy René 104 (ME3): Interaction of microstructurally small cracks with grain boundaries of known character
Y Gao, JS Stölken, M Kumar, RO Ritchie
Acta materialia 55 (9), 3155-3167, 2007
Connectivity and percolation in simulated grain-boundary networks
CA Schuh, RW Minich, M Kumar
Philosophical Magazine 83 (6), 711-726, 2003
Materials science under extreme conditions of pressure and strain rate
BA Remington, G Bazan, J Belak, E Bringa, JD Colvin, MJ Edwards, ...
Metallurgical and Materials Transactions A 35, 2587-2607, 2004
Atomistic mechanism of shock-induced void collapse in nanoporous metals
P Erhart, EM Bringa, M Kumar, K Albe
Physical Review B 72 (5), 052104, 2005
Universal features of grain boundary networks in FCC materials
CA Schuh, M Kumar, WE King
Journal of materials science 40, 847-852, 2005
The α→ ϵ phase transition in iron at strain rates up to∼ 109 s− 1
JC Crowhurst, BW Reed, MR Armstrong, HB Radousky, JA Carter, ...
Journal of Applied Physics 115 (11), 113506, 2014
Ordering reactions in an Ni-25Mo-8Cr alloy
M Kumar, VK Vasudevan
Acta materialia 44 (4), 1591-1600, 1996
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