Deepak Goyal
Cited by
Cited by
Failure mechanism of brittle solder joint fracture in the presence of electroless nickel immersion gold (ENIG) interface
D Goyal, T Lane, P Kinzie, C Panichas, KM Chong, O Villalobos
52nd Electronic Components and Technology Conference 2002.(Cat. No …, 2002
3D microelectronic packaging: from fundamentals to applications
Y Li, D Goyal
Springer, 2017
Electro Optical Terahertz Pulse Reflectometry—an innovative fault isolation tool
Y Cai, Z Wang, R Dias, D Goyal
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
Advanced Fault Isolation and Failure Analysis Techniques for Future Package Technologies.
M Pacheco, Z Wang, L Skoglund, Y Liu, A Medina, A Raman, R Dias, ...
Intel Technology Journal 9 (4), 2005
Detection and characterization of defects in microelectronic packages and boards by means of high-resolution X-ray computed tomography (CT)
M Pacheco, D Goyal
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1263-1268, 2011
X-ray computed tomography for non-destructive failure analysis in microelectronics
M Pacheco, D Goyal
2010 IEEE International Reliability Physics Symposium, 252-258, 2010
Effect of Zn doping in CuO octahedral crystals towards structural, optical, and gas sensing properties
CP Goyal, D Goyal, S K. Rajan, NS Ramgir, Y Shimura, M Navaneethan, ...
Crystals 10 (3), 188, 2020
A review of failure analysis methods for advanced 3D microelectronic packages
Y Li, PKM Srinath, D Goyal
Journal of Electronic Materials 45, 116-124, 2016
HRCT evaluation of microtia: A retrospective study
AR Patil, A Bhalla, P Gupta, D Goyal, S Vishnubhatla, A Ramavat, ...
Indian Journal of Radiology and Imaging 22 (03), 188-194, 2012
Lead-free solder joint void evolution during multiple subsequent high-temperature reflows
Y Li, JS Moore, B Pathangey, RC Dias, D Goyal
IEEE Transactions on Device and Materials Reliability 12 (2), 494-500, 2012
Effect of package design and layout on BGA solder joint reliability of an organic C4 package
B Chandran, D Goyal, J Thomas
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat …, 2000
Inline measurement of molding material thickness using terahertz reflectance
S Liu, NZ Ghosh, Z Wang, D Goyal, S Gokhale, J Zhang
US Patent 9,508,610, 2016
Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens
S Liu, Z Wang, NZ Ghosh, D Goyal
US Patent 9,746,428, 2017
Role of growth temperature in photovoltaic absorber CuSbSe2 deposition through e-beam evaporation
D Goyal, CP Goyal, H Ikeda, P Malar
Materials science in semiconductor processing 108, 104874, 2020
Multi-objective structural optimization of wind turbine tower and foundation systems using Isight: A process automation and design exploration software
JC Nicholson, JS Arora, D Goyal, JM Tinjum
10th World Congress on Structural and Multidisciplinary Optimization, 19-24, 2013
New developments in high-resolution X-ray computed tomography for non-destructive defect detection in next generation package technologies
M Pacheco, D Goyal
ISTFA 2008, 30-35, 2008
Introduction to 3D microelectronic packaging
Y Li, D Goyal
3D Microelectronic Packaging: From Architectures to Applications, 1-16, 2021
Innovations in fault isolation methods for 3d packages with 10x improvement in accuracy
M Xie, T Begala, K Kijkanjanapaiboon, D Goyal
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 755-765, 2016
Key parameters for fast Ni dissolution during electromigration of Sn0. 7Cu solder joint
P Liu, A Overson, D Goyal
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 99-105, 2015
Non destructive failure analysis of 3D electronic packages using both electro optical terahertz pulse reflectometry and 3D X-ray computed tomography
Y Li, Y Cai, M Pacheco, RC Dias, D Goyal
ISTFA, 95-99, 2012
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