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Kang L. WangElectrical Engineering DepartmentVerified email at ee.ucla.edu
Zheng YangUnion CollegeVerified email at union.edu
Faxian XiuPhysics Department, Fudan UniversityVerified email at fudan.edu.cn
Gang ChenProfessor, Mechanical Engineering, massachusetts institute of technologyVerified email at mit.edu
Leelaprasanna Mandalapu JayaramuluSenior Staff Engineer - Product Development, Solaria CorporationVerified email at solaria.com
Alexander A. BalandinDistinguished Professor of Materials Science and Engineering, UCLAVerified email at seas.ucla.edu
Jingjian RenSanDisk, Corp., UC RiversideVerified email at ucr.edu
Zheng ZuoUniversity of California, RiversideVerified email at ucr.edu
Leonid ChernyakUCFVerified email at ucf.edu
Alexander KhitunUniversity of California RiversideVerified email at engr.ucr.edu
Hao TianUniversity of California, RiversideVerified email at ucr.edu
Jian-Guo ZhengDirector of Facilities, Irvine Materials Research Institute, University of California IrvineVerified email at uci.edu
Prof. Theodorian Borca-TasciucProfessor, Rensselaer Polytechnic InstituteVerified email at rpi.edu
M. GoorskyUniversity of California, Los AngelesVerified email at seas.ucla.edu
Alireza KhanakiIntel CorporationVerified email at intel.com
Mildred S. DresselhausLate Professor, MITVerified email at mgm.mit.edu
Renjing ZhengResearch assistant, UC RiversideVerified email at ucr.edu
Zhongguang XuMicron, UC Riverside, institute of microelectronics, CASVerified email at ucr.edu
Muhammad MorshedPhD, Electrical Engineering, U C RiversideVerified email at ucr.edu
Wenhao ShiHuazhong University of Science and TechnologyVerified email at hust.edu.cn
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Jianlin Liu
Professor of Electrical and Computer Engineering, University of California, Riverside
Verified email at ece.ucr.edu - Homepage