| Scaling of trigate junctionless nanowire MOSFET with gate length down to 13 nm S Barraud, M Berthome, R Coquand, M Cassé, T Ernst, MP Samson, ... IEEE Electron Device Letters 33 (9), 1225-1227, 2012 | 263 | 2012 |
| Performance of omega-shaped-gate silicon nanowire MOSFET with diameter down to 8 nm S Barraud, R Coquand, M Casse, M Koyama, JM Hartmann, ... IEEE Electron Device Letters 33 (11), 1526-1528, 2012 | 170 | 2012 |
| Vertically stacked-nanowires MOSFETs in a replacement metal gate process with inner spacer and SiGe source/drain S Barraud, V Lapras, MP Samson, L Gaben, L Grenouillet, ... 2016 IEEE International Electron Devices Meeting (IEDM), 17.6. 1-17.6. 4, 2016 | 122 | 2016 |
| Strain-induced performance enhancement of trigate and omega-gate nanowire FETs scaled down to 10-nm width R Coquand, M Casse, S Barraud, D Cooper, V Maffini-Alvaro, ... IEEE transactions on electron devices 60 (2), 727-732, 2012 | 103 | 2012 |
| Scaling of high-κ/metal-gate TriGate SOI nanowire transistors down to 10 nm width R Coquand, S Barraud, M Cassé, P Leroux, C Vizioz, C Comboroure, ... Solid-State Electronics 88, 32-36, 2013 | 87 | 2013 |
| Method for making a semiconductor device with self-aligned inner spacers S Reboh, E Augendre, R Coquand US Patent 10,217,842, 2019 | 48 | 2019 |
| Investigation of the potentialities of Vertical Resistive RAM (VRRAM) for neuromorphic applications G Piccolboni, G Molas, JM Portal, R Coquand, M Bocquet, D Garbin, ... 2015 IEEE International Electron Devices Meeting (IEDM), 17.2. 1-17.2. 4, 2015 | 40 | 2015 |
| Strain, stress, and mechanical relaxation in fin-patterned Si/SiGe multilayers for sub-7 nm nanosheet gate-all-around device technology S Reboh, R Coquand, S Barraud, N Loubet, N Bernier, G Audoit, ... Applied Physics Letters 112 (5), 2018 | 39 | 2018 |
| Scaling of Ω-gate SOI nanowire N-and P-FET down to 10nm gate length: Size-and orientation-dependent strain effects S Barraud, R Coquand, V Maffini-Alvaro, MP Samson, JM Hartmann, ... 2013 Symposium on VLSI Technology, T230-T231, 2013 | 36 | 2013 |
| Scaling of trigate nanowire (NW) MOSFETs to sub-7 nm width: 300 K transition to single electron transistor V Deshpande, S Barraud, X Jehl, R Wacquez, M Vinet, R Coquand, ... Solid-state electronics 84, 179-184, 2013 | 32 | 2013 |
| Study of carrier transport in strained and unstrained SOI tri-gate and omega-gate silicon nanowire MOSFETs M Koyama, M Cassé, R Coquand, S Barraud, C Vizioz, C Comboroure, ... Solid-state electronics 84, 46-52, 2013 | 25 | 2013 |
| Enhanced performance of P-FET omega-gate SoI nanowire with recessed-SiGe source-drain down to 13-nm gate length S Barraud, R Coquand, JM Hartmann, V Maffini-Alvaro, MP Samson, ... IEEE electron device letters 34 (9), 1103-1105, 2013 | 24 | 2013 |
| Imaging, modeling and engineering of strain in gate-all-around nanosheet transitors S Reboh, R Coquand, N Loubet, N Bernier, E Augendre, R Chao, J Li, ... 2019 IEEE International Electron Devices Meeting (IEDM), 11.5. 1-11.5. 4, 2019 | 21 | 2019 |
| Density Gradient calibration for 2D quantum confinement: Tri-Gate SOI transistor application N Pons, F Triozon, MA Jaud, R Coquand, S Martinie, O Rozeau, ... 2013 international conference on simulation of semiconductor processes and …, 2013 | 19 | 2013 |
| Study of piezoresistive properties of advanced CMOS transistors: thin film SOI, SiGe/SOI, unstrained and strained tri-gate nanowires M Cassé, S Barraud, C Le Royer, M Koyama, R Coquand, D Blachier, ... 2012 International Electron Devices Meeting, 28.1. 1-28.1. 4, 2012 | 19 | 2012 |
| Top-down fabrication and electrical characterization of Si and SiGe nanowires for advanced CMOS technologies S Barraud, B Previtali, V Lapras, R Coquand, C Vizioz, JM Hartmann, ... Semiconductor Science and Technology 34 (7), 074001, 2019 | 18 | 2019 |
| 300 K operating full-CMOS integrated single electron transistor (SET)-FET circuits V Deshpande, R Wacquez, M Vinet, X Jehl, S Barraud, R Coquand, ... 2012 International Electron Devices Meeting, 8.7. 1-8.7. 4, 2012 | 18 | 2012 |
| Method for making a semiconductor device with a compressive stressed channel S Reboh, E Augendre, R Coquand, N Loubet US Patent 10,431,683, 2019 | 17 | 2019 |
| NSP: Physical compact model for stacked-planar and vertical gate-all-around MOSFETs O Rozeau, S Martinie, T Poiroux, F Triozon, S Barraud, J Lacord, ... 2016 IEEE International Electron Devices Meeting (IEDM), 7.5. 1-7.5. 4, 2016 | 15 | 2016 |
| Method for making a semiconductor device with nanowire and aligned external and internal spacers S Barraud, E Augendre, R Coquand, S Reboh US Patent 10,217,849, 2019 | 14 | 2019 |
