Tz-Cheng Chiu
Tz-Cheng Chiu
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Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability
K Zeng, R Stierman, TC Chiu, D Edwards, K Ano, KN Tu
Journal of applied physics 97 (2), 2005
Effect of thermal aging on board level drop reliability for Pb-free BGA packages
TC Chiu, K Zeng, R Stierman, D Edwards, K Ano
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
Stress-induced voiding under vias connected to wide Cu metal leads
ET Ogawa, JW McPherson, JA Rosal, KJ Dickerson, TC Chiu, LY Tsung, ...
2002 IEEE International Reliability Physics Symposium. Proceedings. 40th …, 2002
One-dimensional wave propagation in a functionally graded elastic medium
TC Chiu, F Erdogan
Journal of Sound and Vibration 222 (3), 453-487, 1999
Polymer-embedded solder bumps for reliable plastic package attachment
TC Chiu, MN Variyam
US Patent 6,696,644, 2004
Constitutive behavior of Sn3. 8Ag0. 7Cu and Sn1. 0Ag0. 5Cu alloys at creep and low strain rate regimes
D Bhate, D Chan, G Subbarayan, TC Chiu, V Gupta, DR Edwards
IEEE Transactions on Components and Packaging Technologies 31 (3), 622-633, 2008
Interface reliability assessments for copper/low-k products
CD Hartfield, ET Ogawa, YJ Park, TC Chiu, H Guo
IEEE Transactions on Device and Materials Reliability 4 (2), 129-141, 2004
Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging
TC Chiu, EY Yeh
Microelectronics Reliability 80, 14-23, 2018
Pre-doped reflow interconnections for copper pads
K Zeng, TC Chiu, R Holdford
US Patent App. 10/919,144, 2005
Wire loop grid array package
G Howard, H Test, TC Chiu
US Patent App. 10/741,919, 2005
Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique
TC Chiu, HC Lin
International Journal of Fracture 156, 75-96, 2009
Debonding of graded coatings under in-plane compression
TC Chiu, F Erdogan
International Journal of Solids and Structures 40 (25), 7155-7179, 2003
Heat conduction in a functionally graded medium with an arbitrarily oriented crack
TC Chiu, SW Tsai, CH Chue
International Journal of Heat and Mass Transfer 67, 514-522, 2013
Warpage evolution of overmolded ball grid array package during post-mold curing thermal process
TC Chiu, HW Huang, YS Lai
Microelectronics Reliability 51 (12), 2263-2273, 2011
Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board
TC Chiu, MN Variyam
US Patent 7,294,451, 2007
Composite lid for land grid array (LGA) flip-chip package assembly
TC Chiu
US Patent 6,784,535, 2004
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support
TC Chiu, RC Dunne
US Patent 7,126,217, 2006
System and method for polymer encapsulated solder lid attach
TC Chiu, C Odegard
US Patent App. 11/140,767, 2006
Flip-chip device strengthened by substrate metal ring
TC Chiu, M Yunus
US Patent 6,734,567, 2004
Using DMA to simultaneously acquire Young's relaxation modulus and time-dependent Poisson's ratio of a viscoelastic material
DL Chen, TC Chiu, TC Chen, MH Chung, PF Yang, YS Lai
Procedia Engineering 79, 153-159, 2014
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