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Masataka HigashiwakiOsaka Metropolitan University | National Institute of Information and Communications TechnologyVerified email at omu.ac.jp
Umesh MishraUCSBVerified email at ece.ucsb.edu
Jim SpeckProfessor of Materials, UCSBVerified email at ucsb.edu
Stacia KellerUniversity of California Santa BarbaraVerified email at ece.ucsb.edu
Uttam SingisettiProfessor, Electrical Engineering, Univeristy at Buffalo (SUNY)Verified email at buffalo.edu
Siddharth RajanElectrical and Computer Engineering, Ohio State UniversityVerified email at ece.osu.edu
Steven DenBaarsProfessor of Materials, University of California Santa BarbaraVerified email at engineering.ucsb.edu
David BrownBAE SystemsVerified email at baesystems.com
Stephen W. KaunApeel SciencesVerified email at apeelsciences.com
Keita KonishiNovel Crystal technology, Inc.Verified email at novelcrystal.co.jp
George MalliarasPrince Philip Professor of Technology at University of CambridgeVerified email at cam.ac.uk
Sansaptak DasguptaHardware Engineer, AppleVerified email at apple.com
Richard HillManager - MicronVerified email at micron.com
Tomás PalaciosMITVerified email at mit.edu
Alessandro ChiniProfessor of Electronics, University of Modena and Reggio Emilia, ItalyVerified email at unimore.it
Jing LuUniversity of California, Santa BarbaraVerified email at ece.ucsb.edu
Srabanti ChowdhuryStanford UniversityVerified email at stanford.edu
Rongming ChuThe Pennsylvania State UniversityVerified email at psu.edu
Aaron ArehartAssistant Research Professor of Electrical and Computer Engineering, The Ohio State UniversityVerified email at osu.edu
Steven RingelThe Ohio State UniversityVerified email at osu.edu
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Man Hoi Wong
Associate Professor, ECE, Hong Kong University of Science and Technology
Verified email at ust.hk